Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${pm}$5${mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.