The characteristion of composite electroless Nikel palting on the condition of adding 3kinds ceramic dispersives, Al2O3, Si3O4 and artificial diamond powder were studied. Decreasing solution temperature for composite plating was required to depress the spontaneous decomposition caused by dispersive including enlargement of reaction surface. The rate of composite plating was faster than that of general electroless-Nickel plating without dispersive. this increasing tendency of plating rate was remarkable for the active catalysis, like diamond powder.