The effects of intermetallic compound growt on the sheet resistance and soldreability as functions of the aging time, the temperature, and the conditions of substrates have been investi-gated in the electroplallic compound (mainy Cu6Sn5and Ni3Sn4) and the number of phase interface increased, the sheet resistance increased. Spread tests showed that the solderability was dereased with the intermetallic compounds growth and increased with the thickness of electroplated Sn. The surface morphology or agin size of the compound layer singificantly affect the solderability. The solderability of Sn/Ni system was superiot to Sn/Ni system was sperior to that of Sn/Cu system and the intermetallic compounds growth was solwer in the former system.