본 연구에서는 초음파 펄스 파형을 주파수 영역에서 해석하는 초음파 주파수 분석법을 결함 모델에 적용하여 결함의 정량화의 가능성을 검토하고, 그 결과를 반도 체 패키지내에 존재하는 보이드 및 박리에 응용함으로써 초음파 주파수 분석법에 기초 한 결함의 정량화에 관하여 연구하였다.
In recent years, along with the development of ultrasonic probe with wide frequency range, the digitization of measuring instrument, and the development of operating process technics, it is possible to analyze ultrasonic pulse in frequency range. In this paper, applying to flaw model the ultrasonic spectroscopy method that can analyze ultrassonic pulse in frequency range, we examine the possibility of quantification of flaw and apply its result to the void and seperation in LSI package. Consequently, by using the change in frequency distribution and central frequency of sltrasonic pulse detected from flaw, the estimation of shape, size, and depth of flaw is possible. The change in central frequency is changed minutely by the sample materals and position of flaw, but changed mainly by the shape and size of flaw. And we can quantify the shape and size of flaw in LSI pakcage using the experimental result through flaw model.
