실리콘이 주입된 CaAs 기판위에 플라즈마 화학 증착법으로 자기정렬 gate구조의 Schottky contact을 형성하였다. 갈륨비소 소자 제조를 위하여 두께 1600$AA$의 턴스텐질화막을 $350^{circ}C$에서 증착하여 $750^{circ}C$에서 $900^{circ}C$까지 급속 열처리 하였다. 텅스텐 질화막과 GaAs계면의 열적 안정성을 XRD(X-ray diffraction), PL(photoluminescence),ODLTS(optical deep livel transient spectroscopy)측정으로 조사하였으며, W보다 $W_{67}N_{33}$ gate를 형성시킬 경우에 GaAs에 미치는 열적손상이 적음을 알 수 있으며 이온 주입한 Si이온이 활성화 되는 것으로 생각된다. $W_{67}N_{33}$ GaAs 다이오드가 약 800-$900^{circ}C$의 고온열처리 온도에서 W/GaAs 다이오드의 경우보다 열적 안정성이 우수하였다.
Self-alignment gatc Schottky contact structure on Si- implanted GaAs was formed by plasma enhanced chemical vapor dcposirion. Tungsten nitride thin films (ahclut 1600$AA$) vcre dopositcd on GaAs at $350^{circ}C$ in order to fahricarc GaAs 1Cs and ttwn rapidly annealed at $750^{circ}C$ to $900^{circ}C$. Thermal charac tcristics of PECVD)-$W_{67}N_{43}$/GaAs structure were investigated by X-ray diffraction, photolumintesccnce. and optical deep level transient specrroscopy. Results revealed that $W_{67}N_{33}$ gate was more thermally sta ble with GaAs substrate than W gate and Si atoms implanted In $W_{67}N_{33}$/GaAs structure became morr active than those In W/GaAs after annealing. I-V characteristics of $W_{67}N_{33}$/GaAs diod c exhibired a nearly ideal diode behavior. The termal stability of $W_{67}N_{33}$/GaAs diode was better than that of W/GaAs diode with the post annealing at temperatures from 800 to $900^{circ}C$ for 20s without As overpressure.
