- 무전해 Ni 도금의 전기화학적 고찰
- ㆍ 저자명
- 김영기,이원해
- ㆍ 간행물명
- 한국표면공학회지
- ㆍ 권/호정보
- 1993년|26권 4호|pp.175-182 (8 pages)
- ㆍ 발행정보
- 한국표면공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.