As a fundamental study on effects of thermal-cycles on residual stress of ceramics/metal joints, residual stresses in $Si_3N_4$/SUS304 joint specimens were measured before and single thermal-cycle by X-ray diffraction method and finite element method(FEM). The residual stress was found to increase after single thermal-cycle, which was agreeable with the results of residual stress measurement by X-ray diffraction method and residual stress analysis by finite element method. After the residual stress measurement, 4-point bending tests were performed. The relationship between the bending strength, the thermal-cycle temperature and hold time was examined. The bending strength was found to decrease with the increase of residual stress in linear relation.