Electronic products can be subjected to many different forms of shock. These shocks are usually experienced during transporting the electronic products from a manufacturer to customers. Drop tests are performed to test the product fragility before shipment. Package cushioning materials are often used to protect electronic products from severs shock environments. In the present paper, an algorithm to predict the shock responses of the main mechanical parts is developed by use of the shock analysis in which the modal parameters extracted from vibration test are used. These results are in good agreement with the results of drop test. By use of the shock response prediction algorithm developed herein, it is possible to predict the results of drop test at various drop directions and also to select the optimal package cushioning materials.