화학증착법에 의해 TiO2 박막을 Si-wafer(100)위에 제조하였다. Titanium tetraisopropoxide (TTIP)를 출발물질로 하여 200-500℃의 온도범위에서 증착을 행하였다. 증착된 박막의 두께는 Ellipsometry 및 SEM을 사용하여 측정하였으며, 산소의 함량에 따른 증착층의 성분분석은 ESCA를 사용하였다. TiO2 박막의 증착속도는 산소의 함량에 따라 증가하였고, 반응가스인 산소를 공급하지 않았을 때 증착층내에 불순물로 탄소가 존재하였으며, 증착층의 성분은 내부로 갈수록 TiO2에서 Ti로 변하였다. 산소를 600scm 공급하였을 때 증착층내에 소량의 탄소가 존재하였으며, 증착층의 성분은 내부로 갈수록 TiO2에서 TiO, Ti로 됨을 알 수 있었다. 산소를 1200scm공급하였을 때 증착층내에 탄소가 존재하지 않았으며, 증착층 성분은 표면에는 TiO2를 이루나 증착층 내부로 갈수록 Ti복합화합물을 이루고 있었다.
TiO2 thin films were prepared on a (100)silicon wafer using a chemical vapor deposition(CVD) method. The deposition experiments were performed using the TTIP in the deposition temperature ransing from 200 content. The deposition rate of TiO2 was increased with the substrate temperature and the oxygen content. The thickness of the deposited thin film and the compositional analysis of this thin films with theoxygen content were measured using Ellipsometry, SEM and ESCA, respectively. The deposited thin film was composed of a bilayer, external TiO2 and internal Ti. Carbon as a residual impurity was found to remain when zero sccm O2 was purged into a reaction chamber and the composition of the deposited thin film was found to change Ti into TiO in a deeper layer. However, when 600sccm O2 was supplied to a reaction chamber, it has been found to reside less carbon content than without O2. Finally, in the condition of 1200sccm O2, no impurity level of carbon was observed and a deeper layer consisted of the Ti composite, even though the deposited surface was composed of TiO2.
