In this paper, we studyed the variables in the design of multichip memory modules with 4M$ imes$1bit DRAM chips to construct high capacity and high speed memory modules. The configuration of the module was 8 bit, 16 bit, and 32 bit DRAM modules with employing 0.6 W, 70 nsec 4M$ imes$1 bit DRAM chips. We optimized routing area and wiring density by performing the routing experiment with the variables of the chip allocation, module I/O terminal, the number of wiring, and the number of mounting side of the chips. The multichip module was designed to be able to accept MCM-L techiques and low cost PCB materials. The module routing experiment showed that it was an efficient way to align chip I/O terminals and module I/O terminals in parallel when mounting bare chips, and in perpendicular when mounting packaged chips, to set module I/O terminals in two sides, to use double sided substrates, and to allocate chips in a row. The efficient number of wiring layer was 4 layers when designing single sided bare chip mounting modules and 6 layers when constructing double sided bare chip mounting modules whereas the number of wiring layer was 3 layers when using single sided packaged chip mounting substrates and 5 layers when constructing double sided packaged chip mounting substrates. The most efficient configuration was to mount bare chips on doubled substrates and also to increase the number of mounting chips. The fabrication of memory multichip module showed that the modules with bare chips can be reduced to a half in volume and one third in weight comparing to the module with packaged chips. The signal propagation delay time on module substrate was reduced to 0.5-1 nsec.