열벽 증착(hot-wall evaporation)방법으로 Cu를 첨가한 ZnTe박막을 성장하였다. doping을 하지 않은 ZnTe박막의 전기 전도형은 p-형으로 전기 전도도는 $10^{-6}({Omega}{cdot}cm)^{-1}$을 정도로 매우 낮았다. 첨가한 Cu의 양에 따라 전기 전도도는 $10^2({Omega}{cdot}cm)^{-1}$까지 증가하였으나 이동도는 크게 변하재 않았다. Cu를 매우 많이 첨가한 경우는 금속과 같은 전기 전도도를 관찰하였다.
Cu-doped ZnTe thin films have been grown by hot-wall evaporation. The electrical conductivity of the intrinsic ZnTe film was of p-type and as low as $10^{-6}({Omega}{cdot}cm)^{-1}$. As the doped Cu concentration was increased, the electrical conductivity was increased. up to $10^2({Omega}{cdot}cm)^{-1}$, but the mobility was decreased a little. The heavily doped sample shows the metal-like electrical resistivity.
