본 연구에서는 기존에 알려진 구리 전구체와 새롭게 개발된 전구체인 hfac (hexafluoroacetylacetonate) Cu(I) DMB (3,3-dimethyl-1-butene)를 비교 평가해보았다. (Hfac)Cu(I) (DMB)의 증가압은 $40^{circ}C$에서 3 torr 정도로 기존에 잘 알려진 (hfac)Cu(I) vinyltrimethylsilane (VTMS) 보다 10배 정도 높은 것으로 나타났으며 그럼에도 불구하고 상당히 안정하여 $65^{circ}C$에서 일주일 이상 가열하여도 변하지 않았다. 이 전구체로 100-$280^{circ}C$에서 구리 박막을 증착할 수 있었으며 150-$250^{circ}C$온도 범위에서 2.0$muOmega$-cm의 순수한 구리 박막을 얻었다. 구리 박막의 증착 속도는 기존의 전구체보다 7~8배 정도 높은 것으로 나타났다.
An organometallic precursor, hfac(hexafluoroacetylacetonate) Cu(I) DMB (3,3-dimethyl- 1-butene) was synthesized, evaluated and compared with other precursors for metal organic chemical vapor deposition of copper thin films. It was found that at $40^{circ}C$, the vapor pressure was an order of magnitude higher (about 3 torr) than (hfac) Cu vinyltrimethylsilane (VTMS) and films could be deposited at the substrate temperature of 100-$280^{circ}C$ with deposition rate substantially higher. The copper films contained no detectable impurities as measured by Auger electron spectroscopy and had a resistivity of about 2.0$muOmega$-cm in the deposition temperature range of 150 to $250^{circ}C$. From the thermal analysis, (hfac)Cu(I)(DMB) is believed to be quite stable and no appreciable amount of precipitation was observed at $65^{circ}C$ heating for more than a month.
