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INDUSTRIAL STATUS OF DRY PLATING AS AN ALTERNATIVE TO WET PLATING PROCESS IN KOREAN SURFACE FINISHING INDUSTRY
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  • INDUSTRIAL STATUS OF DRY PLATING AS AN ALTERNATIVE TO WET PLATING PROCESS IN KOREAN SURFACE FINISHING INDUSTRY
  • INDUSTRIAL STATUS OF DRY PLATING AS AN ALTERNATIVE TO WET PLATING PROCESS IN KOREAN SURFACE FINISHING INDUSTRY
저자명
Kwon. Sik-Chol,Baek. Woon-Sung,Lee. Gun-Hwan,Rha. Jong-Joo
간행물명
한국표면공학회지
권/호정보
1999년|32권 3호|pp.253-256 (4 pages)
발행정보
한국표면공학회
파일정보
정기간행물|ENG|
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기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

Wet plating has been initiated and developed as a major surface finishing technology as of the long customized and highly productive process until now. As the external compression by virtue of the environmental preservation becomes stricter, there has been new move to adapt dry plating line instead of conventional wet plating one in domestic surface finishing industry. Dry plating, so-called, plasma surface technology has been developed in semiconducting industry and becomes a key technology to be useful as an alternative to wet plating in surface finishing industry. The historical progress of domestic surface finishing industry was outlined with the background on the adaptation of three dry plating processes-plasma spraying, plasma nitriding and ion plating. The present status of domestic industrial activity was covered on major alternative to wet plating.