- 초음파 진동 부가에 의한 세라믹 복합체의 형조방전가공
- ㆍ 저자명
- 왕덕현,우정윤,윤존도,Wang. Duck-Hyun,Woo. Jeong-Yun,Yun. Jon-Do
- ㆍ 간행물명
- 한국정밀공학회지
- ㆍ 권/호정보
- 1999년|16권 8호|pp.9-15 (7 pages)
- ㆍ 발행정보
- 한국정밀공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Die-sinking electrical discharge machining(EDM) for conductive ceramic matrix composite(CMC) of Tic/$Al_2O_3$ was experienced with addition of ultrasonic emission, and the results were compared with ones obtained by the EDM only. From this experimental study, the values of material removal rate(MRR) and surface roughness($R_{max}$), scanning electron microscope(SEM) micrographs, and weibull probability distribution of bending strength for the specimens were obtained and compared. The trend of MRR was found to be increased slightly with the current and the duty factor for both EDM only and EDM with ultrasonic emission. The MRR values were found to be increased for EDM with ultrasonic emission. The SEM micrographs of EDMed surface by under various operating conditions showed less micro cracks in various places. Although smaller bending strength value was obtained by EDMed surface with ultrasonic emission by weibull probability distribution analysis of bending strength.