Cu-based leadframe sheets were oxidized ic a hot alkaline solution to black-oxide layer on the surface and molded with epoxy molding compound(EMC), and finally machined to form sandwiched double-cantilever beam(SDCB) and sandwiched Brazil-nut(SBN)specimers to measure the adhesion strength of leadframe-EMC interface. The SDCB and the SBN specimens were designed to measure the adhesion strength in terms fracture toughness under puasi-mode I and mixed mode loadinf, respectively. After the tests, fracture surfaces were analyzed paths were observed in the SDCB-tested speciments, failure paths varied with crack speed and loading conditions.