Recently, a slightest influence to the circuit can be a great damage because the size of semiconductor smaller. It must be controlled the chippingless dicing process and the precision dicing without any damage to tile circuit. In this study, the relationship between chipping effect and the force of dicing was analysed. The rate of chipping was decreased as the farce of dicing decreased. It was also examined that the farce of dicing decreased according to the lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve the chippingless process.