A practical scheme to reduce failure of the PCB(Printed Circuit Board) of a monitor is introduced using deformed mode shape under mechanical shock. When the monitor is given critical shock loads, cracks are commonly initiated at the tip of a hole on the PCB. Accordingly, a deformed mode shape of the PCB is obtained using a FEM code to define a weak point on the PCB under mechanical shock, and then the position and direction of the hole is determined to prevent the failure at the critical mode shape. Also, the stress intensity factor around the weak point on the PCB is calculated to check the possibility of fracture by normal tensile stress. In conclusion, present research is useful to assist the practical design of components-layout on the PCB.