A heat pipe heat sink device which is to evacuate maximum heat of about 1800W from a powersemiconductor was designed and manufactured One set of cooling device os composed of an Aluminum block (130${ imes}$160${ imes}$35mm) 4 PFC heat pipes $(d_0 22.23mm)$ and 126 Aluminium fins (250${ imes}$58${ imes}$0.8mm) Experimental data obtained at a power of 1~2kW revealed that the total thermal resistance of the device varied 0.02~0.018$^{circ}C$/W along with increasing air velocity from 2m/s to 3 m/s. The result represented a good satisfaction of requirement condition to maintain temperature rise of semiconductor lowe that $40^{circ}C$ at 1800W and air velocity of 3 m/s Some important resistance such as convective resistances at both fins and heat pipes showed good agreement between mathematical predictions and measurement data.