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유도대전소자모델(FCDM)을 이용한 ESD에 의한 반도체소자의 손상 메커니즘 해석
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  • 유도대전소자모델(FCDM)을 이용한 ESD에 의한 반도체소자의 손상 메커니즘 해석
  • An Analysis of Damage Mechanism of Semiconductor Devices by ESD Using Field-induced Charged Device Model
저자명
김두현,김상렬
간행물명
한국산업안전학회지
권/호정보
2001년|16권 2호|pp.57-62 (6 pages)
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한국안전학회
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정기간행물|
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기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

In order to analyze the mechanism of semiconductor device damages by ESD, this paper adopts a new charged-device model(CDM), field-induced charged nudel(FCDM), simulator that is suitable for rapid routine testing of semiconductor devices and provides a fast and inexpensive test that faithfully represents ESD hazards in plants. The high voltage applied to the device under test is raised by the fie]d of non-contacting electrodes in the FCDM simulator. which avoids premature device stressing and permits a faster test cycle. Discharge current md time are measured and calculated The FCDM simulator places the device at a huh voltage without transferring charge to it, by using a non-contacting electrode. The only charge transfer in the FCMD simulator happens during the discharge. This paper examine the field charging mechanism, measure device thresholds, and analyze failure modes. The FCDM simulator provides a Int and inexpensive test that faithfully represents factory ESD hazards. The damaged devices obtained in the simulator are analyzed and evaluated by SEM Also the results in this paper can be used for to prevent semiconductor devices from ESD hazards.