The static creep behaviors of dispersion strengthened copper GlidCop were investigated over the temperature range of $650{sim}690^{circ}C$ (0.7Tm) and the stress range of 40~55 MPa (4.077~5.61 $kg/mm^2$). The stress exponents for the static creep deformation of this alloy was 8.42, 9.01, 9.25, 9.66 at the temperature of 690, 677, 663, and $650^{circ}C$, respectively. The stress exponent, (n) increased with decreasing the temperature and became dose to 10. The apparent activation energy for the static creep deformation, (Q) was 374.79, 368.06, 361.83, and 357.61 kg/mole for the stress of 40, 45, 50, and 55 MPa, respectively. The activation energy (Q) decreased with increasing the stress and was higher than that of self diffusion of Cu in the dispersion strengthened copper. In results, it can be concluded that the static creep deformation for dispersion strengthened copper was controlled by the dislocation climb over the ranges of the experimental conditions. Larson-Miller parameter (P) for the crept specimens for dispersion strengthened copper under the static creep conditions was obtained as P=(T+460)(logtr+23). The failure plane observed for SEM slightly showed up transgranular at that experimental range, however, universally it was dominated by characteristic of the intergranular fracture.