In this paper, the characteristics of silicon wafer surface which is textured by KOH anisotropic etching method and mechanical polishing are investigated from the viewpoint of stiction and friction. It was found that the characteristics of stiction and friction of each textured surface are dependent on the contact area characterized by surface parameters such as bearing length ratio and peak count. To find the mechanism of the variation of stiction and friction in textured surface, OTS SAM coated wafer was used. In this case, the variation of stiction and friction was diminished, Therefore, it is concluded that the reason of variation of stiction and friction on textured surface is mainly caused by capillary which in turn is affected by the surface topography