A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $mu$m while 90% of solder particles was smaller than 297 $mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$mu$m was shorter than for particles sized between 149$mu$m and 297$mu$m. As the recovery location becomes shorter, KI value increases towards unity while $phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.