Finite element technique considering adhesive forces is proposed and applied to analyze the behavior of elastic hemispherical asperity adhesively contacting the plane surface of semi -infinite rigid body. It is demonstrated that the finite element model simulates interfacial phenomena such as jump -to-contact and adhesion hysteresis that cannot be simulated with the currently available adhesive contact continuum models. This simulation aiso provides valuable information on contact pressure, contact region and stress distributions. This technique is anticipated to be utilized in designing a low-adhesion surface profile for MEMS/NEMS applications since various contact geometries can be analyzed with this technique.