The self-aligning effect is useful in the electronic packaging because it compensates the positional errors occurred in flip chip placement. The solder shapes are predicted in this work either by minimizing the energy of the solder profile using the second-order polynomials or by the Surface Evolver program. The restoring forces and spring constants in vertical and horizontal directions are calculated to estimate the self-aligning effect. The calculated results using the second-order polynomial are similar to those using the Surface Evolver in the vertical direction. However, significant discrepancy between the results using the polynomial and Surface Evolver occurs in the horizontal direction. The assumption of the circular cross-section of the solder joint appears to cause the discrepancy. As the horizontal restoring force and spring constant are smaller than those in the vertical direction, larger aligning error can be resulted in the horizontal direction.