- O2/ Ar 플라즈마 처리에 의해 개질된 폴리카보네이트 기판에서 Cu의 밀착성
- ㆍ 저자명
- 박준규,김동원,김상호,이연승,Park. Jun-Kyu,Kim. Dong-Won,Kim. Sang-Ho,Lee. Youn-Seoung
- ㆍ 간행물명
- 한국재료학회지
- ㆍ 권/호정보
- 2002년|12권 9호|pp.740-746 (7 pages)
- ㆍ 발행정보
- 한국재료학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
In this study, the polycarbonate surface was treated by $O_2$/ Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the $O_2$/ Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the$ O_2$/ Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by $O_2$/ Ar gases plasma treatment. Therefore,$O_2$/ Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.