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패키지 반도체소자의 ESD 손상에 대한 실험적 연구
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취소
  • 패키지 반도체소자의 ESD 손상에 대한 실험적 연구
  • Experimental Investigation of the Electrostatic Discharge(ESD) Damage in Packaged Semiconductor Devices
저자명
김상렬,김두현,강동규,Kim. Sang-Ryull,Kim. Doo-Hyun,Kang. Dong-Kyu
간행물명
산업안전학회지
권/호정보
2002년|17권 4호|pp.94-100 (7 pages)
발행정보
한국안전학회
파일정보
정기간행물|
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기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
서지반출

기타언어초록

As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipments need to be more alert to the problem of electrostatic discharges(ESD). In order to analyze damage characteristics of semiconductor device damaged by ESD, this study adopts a new charged-device model(CDM), field-induced charged model(FCDM) simulator that is suitable for rapid, routine testing of semiconductor devices and provides a fast and inexpensive test that faithfully represents ESD hazards in plants. High voltage applied to the device under test is raised by the field of non-contacting electrodes in the FCDM simulator, which avoids premature device stressing and permits a faster test cycle. Discharge current and time are measured and calculated. The characteristics of electrostatic attenuation of domestic semiconductor devices are investigated to evaluate the ESD phenomena in the semiconductors. Also, the field charging mechanism, the device thresholds and failure modes are investigated and analyzed. The damaged devices obtained in the simulator are analyzed and evaluated by SEM. The results obtained in this paper can be used to prevent semiconductor devices form ESD hazards and be a foundation of research area and industry relevant to ESD phenomena.