- 전자현미경내 마이크로 절삭의 화상처리에 의한 절삭 기구 해석
- ㆍ 저자명
- 허성중
- ㆍ 간행물명
- 한국공작기계학회논문집
- ㆍ 권/호정보
- 2003년|12권 3호|pp.89-95 (7 pages)
- ㆍ 발행정보
- 한국공작기계학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
This research analyzes the cutting mechanism of A1100-H18 of commercially pure aluminum by image processing in SEM(Scanning Electron Microscope) for the measurement of strain rate distribution near a cutting edge in orthogonal micro-cutting. The distribution is measured using various methods in order. The methods are in-situ observations of cutting process in SEM, inputting image data, a computer image processing, calculating displacements by SSDA(Sequential Similarity Detection Algorithm) and calculating strain rates by FEM. The min results obtained are as follows: (1)It enables to measure a microscopic displacement near a cutting edge. (2) An application of this system to cutting process of various materials will help to make cutting mechanism clear.