A Multi-Layer Ceramic (MLC) chip type Band-Pass Filter (BPF) using BiNb$\_$0.975/Sb$\_$0.025/ $O_4$ LTCC (Low Temperature Co-fired Ceramics) and MLC processing is presented. The MLC chip BPF has the benefits of low cost and small size. The BPF consists of coupled stripline resonators and coupling capacitors. The BPF is designed to have an attenuation pole at below the passband for a receiver band of IMT-2000 handset. The computer-aided design technology is applied for analysis of the BPF frequency characteristics. The attenuation pole depends on the coupling between resonators and the coupling capacitance. An equivalent circuit and structure of MLC chip BPF are proposed. The frequency characteristics of the manufactured BPF is well acceptable for IMT-2000 application.