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분말법과 주조법으로 제조한 coated conductor용 Ni 기판 개발
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  • 분말법과 주조법으로 제조한 coated conductor용 Ni 기판 개발
  • Fabrication of textured Ni substrates for coated conductor prepared by powder metallurgy and plasma arc melting method
저자명
임준형,김정호,김규태,장석헌,주진호,나완수,홍계원,지봉기,김찬중
간행물명
Progress in superconductivity
권/호정보
2003년|5권 1호|pp.70-74 (5 pages)
발행정보
한국초전도학회
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기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

We fabricated cube textured Ni substrate for YBCO coated conductor and evaluated the effects of processing parameters on microstructural evolution and texture formation. Ni-rods as an initial specimen were prepared by two different methods, i.e., powder metallurgy(PM) and plasma arc melting(PAM). Subsequently, the rods were cold rolled to 100 $mu extrm{m}$ thick substrate and annealed at temperatures of $700∼1200^{circ}C$. The texture of the substrate was characterized by pole-figure. It was observed that the texture of substrate made by P/M did not significantly varied with annealing temperature of 600∼$l100^{circ}C$ and the full-width at half-maximums (FWHM) of both in-plane and out-of-plane were 9$^{circ}$∼$10^{circ}$. On the other hand, the texture of substrate made by PAM was more dependent on the annealing temperature and the corresponding values were $9^{circ}$ ∼$13^{circ}$ at the temperature range. In addition, recrystallization twin texture, (221)<221>, was formed as the temperature increased further. OM profiles showed that the grain size of substrate made by P/M was smaller than that made by PAM and this difference was correlated to the microstructure of initial specimens.