- 미세 캐비티 방전 가공에서 바닥면 형상 왜곡
- ㆍ 저자명
- 임종훈,류시형,제성욱,주종남
- ㆍ 간행물명
- 한국정밀공학회지
- ㆍ 권/호정보
- 2003년|20권 12호|pp.191-197 (7 pages)
- ㆍ 발행정보
- 한국정밀공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
As mechanical components are miniaturized, the demand on micro die and mold is increasing. Micro mechanical components usually have high hardness and good conductivity. So micro electrical discharge machining (MEDM) is an effective way to machine those components. In micro cavity fabrication using MEDM, it is observed that the bottom surface of cavity is distorted. Electric charges tend to be concentrated at the sharp edge. At the center of the bottom surface, debris can not be drawn off easily. These two phenomena make the bottom surface of the electrode and workpiece distort. As machining depth increases, the distorted shape of electrode approaches hemisphere. This process is affected by capacitance and the size of electrode. By using a smaller electrode than the desired cavity size and appropriate tool movement, bottom shape distortion can be prevented.