Today, We have used many electronic equipment such as computer, TV, cellular phone and so on. These equipment radiate a large amount of EMI(Electromagnetic interference) which is occurred trouble of airplane, medical equipment, communicate equipment, and especially, human health. So, Ni mesh fabrication for EMI shielding by continuous electroforming process was investigated. Continuous electroforming apparatus was made by means of rotating cathode drum. And We investigated the characteristics of two types of Ni electroforming solution. One was made by laboratory and the other was produced by M cooperation. The grain size increased with increasing current density and bath temperature, and decreasing rotating speed of cathode drum. EDX results indicate that the Ni mesh electroformed by the KIMM solution is composed of pure Ni. But the Ni mesh electroformed by the M cooperation solution has Ni and S element. The incorporation of S element in the Ni mesh has a profoundly effect on mechanical properties such as hardness, internal stress and so on.