In many part of machines or structures that made of bimaterial bonded with two dissimilar materials, most failures occur at their interface. Therefore, the accurate analysis of fracture characteristics and the evaluation of mechanical strength for interfacial crack are essential when we design those structures. In this research, stress and displacement components in the vicinity of stationary interfacial crack tip in the two dissimilar isotropic bimaterials are established. Hereafter, the stress components established in this research can be applied to the photoelastic hybrid method which can be used to analyze the fracture behavior of the two dissimilar isotropic bimaterials.