Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetronsputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of e and cycle time of A, the characteristics and thickness of the deposited copper film are controlled. As $ heta$ value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at $ heta=0.33$ and cycle time of 30 min. The uniformity of copper film shows $5\%$ in our experimental range.
