- 방전 가공을 이용한 미세 구멍 가공 시 발생하는 테이퍼 형상의 제어
- ㆍ 저자명
- 김동준,이상민,이영수,주종남,Kim. Dong Jun,Yi. Sang Min,Lee. Young Soo,Chu. Chong Nam
- ㆍ 간행물명
- 한국정밀공학회지
- ㆍ 권/호정보
- 2005년|22권 4호|pp.52-59 (8 pages)
- ㆍ 발행정보
- 한국정밀공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
When a micro hole is machined by EDM with a cylindrical electrode, the hole diameter is different at the inlet and the outlet of the micro hole. The taper shape of the micro hole is caused by not only wear of the electrode but the eroded particles. The eroded particles cause secondary discharge during machining the micro hole. As a result, the diameter of the inlet becomes larger than that of the outlet. In this paper, a new method is proposed to reduce the difference in diameter between the inlet and the outlet of the hole. Observed was that the feed depth and machining time affect the formation of taper shape On this experimental basis, ultrasonic vibration was applied to reduce machining time, and capacitance was changed during machining to use the difference in discharging energy of different capacitances. Using the proposed method, a straight micro-hole was fabricated.