This paper reports experimental results on microdrilling process for silicon parts used in semiconductor equipments. An experimental system was developed consisting of a high speed precision machine, microscope system, and project profile instrument. The experimental results indicate that the amount of chipping at the entrance and exit of micro hole decreases as the spindle speed increases up to 18,000 rpm. At higher spindle speed, however, the amount of chipping increases rapidly. The amount of chipping and infeed rate show proportional relationship up to 20 m/min of infeed rate. Beyond that infeed rate, however, sudden increase in the amount of chipping has occurred.