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패드 그루브의 치수가 CMP 연마특성에 미치는 영향
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  • 패드 그루브의 치수가 CMP 연마특성에 미치는 영향
저자명
박기현,김형재,최재영,서헌덕,정해도,Park. Ki-Hyun,Kim. Hyoung-Jae,Choi. Jae-young,Seo. Heon-deok,Jeong. Hae-do
간행물명
大韓機械學會論文集. Transactions of the Korean Society of mechanical engineers. A. A
권/호정보
2005년|29권 3호|pp.432-438 (7 pages)
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대한기계학회
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정기간행물|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

CMP characteristics such as material removal rate and edge effect were measured and investigated in accordance with pad grooving effect, groove width, depth and pitch. GSQ (Groove Stiffness Quotient) and GFQ (Groove Flow Quotient) were proposed to estimate pad grooving characteristics. GSQ is defined as groove depth(D) divided by pad thickness(T) and GFQ is defined as groove width(W) divided by groove pitch(P). As GFQ value increased, material removal rate increased some point but gradually saturated. It seems that material removal rate is not affected by each parameter respectively but by interaction of these parameters such as groove dimensions. In addition, an increase in GFQ and GSQ causes edge effect to be improved. Because, pad stiffness decreases as GSQ and GFQ increase. In conclusion, groove influences relative pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. The change of groove dimensions has influence on pad stiffness and slurry flow, so that polishing results such as removal rate and edge effect become changed.