Joining ceramics to metals has a variety of applications both in the structural and the electronics fields. One of the great benefits of the adoption of joining into the structural applications is to provide reliability to the ceramic components by backing up with metal components. In joining ceramics and metals, two key factors, i.e., establishing chemical bonding at interfaces and dissipation of thermal stress across interfaces, should be paid for attention. Many joining methods have been already established such as adhesive and mechanical joining, brazing and soldering, and solid state bonding. Each has its own benefits with some drawbacks. One can select a suitable process and materials following the requirements of the application. This report focuses on the current status of joining technology for ceramics/metal system.