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Family 금형의 충전 균형을 위한 실험적 연구
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  • Family 금형의 충전 균형을 위한 실험적 연구
저자명
박형필,차백순,이병옥,Park. H. P.,Cha. B. S.,Rhee. B. O.
간행물명
소성가공
권/호정보
2006년|15권 1호|pp.47-56 (10 pages)
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한국소성가공학회
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

It is well known that the family-mold has an advantage to reduce the cost for production and mold. However, defects are frequently occurred by over packing the smaller volume cavity during molding, especially when the family-mold has a volumetric difference between two cavities. In this study, the cavity-filling imbalance was confirmed by the temperature and the pressure sensors, and a variable-runner system was developed for balancing the cavity-filling. Experiments of balancing the cavity filling was carried out in the family-mold with the variable-runner system, and balancing the cavity-filling was confirmed by changing the cross-sectional area of a runner in the variable-runner system with the temperature and pressure sensors. The influence of the injection speed to the balancing-capability of the variable-runner system was also examined in the experiment.