In this study, warpage characteristics of mobile phone cover through injection molding process were investigated using design of experiments in injection molding process. Warpage in plastic injection molding has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature and melt temperature on the warpage of mobile phone cover were considered by numerical analysis and experiment with Taguchi method. The degree of warpage for the injection molded part was measured by using three dimensional coordinate measurement machine. It was shown that temperature control factor has more significant effect on the warpage of mobile phone cover than pressure control factor.