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A model to simulate surface roughness in the pad dressing process
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  • A model to simulate surface roughness in the pad dressing process
  • A model to simulate surface roughness in the pad dressing process
저자명
Horng. T.L.
간행물명
Journal of mechanical science and technology
권/호정보
2007년|21권 10호|pp.1599-1604 (6 pages)
발행정보
대한기계학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

Pad dressing, which is one of the most important planarization processes, is widely used in CMP. The estimation of surface roughness under various machining parameters (such as dressing force, diamond density of the dresser, rotational speed of the dresser, different machining paths, etc.) is essential to the pad dressing process. In this study, elastic-plastic theory and the wear model are used to construct the expression for the magnitude of material removal as a function of the indentation depth. The deformation of the pad is obtained by using elastic-plastic theory, and the material removal caused by individual micro-contacts is calculated with the help of wear theory. Finally, the macroscopic wear volume is found by summing the volumetric wear of each individual micro-contact. A parametric study is conducted to explore the influence on the surface roughness results and the pad dressing interfacial phenomena of operational parameters. The results reveal that a rapid initial improvement followed by a leveling off, manifesting a saturation effect. Moreover, the model shows that a higher dressing force with a dresser speed close to the pad speed and a moderate translation speed increase the material removal rate corresponding with a lower surface roughness dressing.