The characteristics of femtosecond laser ablation of $Al_2O_3$ for prescision microfabrication are studied experimentally. Specifically, the process time during femtosecond laser drilling of microholes with $sub-100{mu}m$ diameter are investigated for varying laser fluence, scan speed and beam path designs like trepanning with continuously changed start points. The accumulation of sub-micrometer size particles within the hole and the deterioration of edge clarity and roundness for decreasing hole diameter are examined and through process optimization the microdrilling with good hole quality is achieved using a femtosecond laser system (repetitionrate 1 kHz, wavelength 785 nm, pulse duration 185 fs)