As the structure of a mobile phone becomes thin to catch up with a slim product trend, the structural strength and resistance to shock of TFT-LCD module are getting to be reduced. Hence, TFT-LCD module is the strength reinforced by bezel frame. The bezel frame was produced by the multi hemming processes with several folding parts. The determination of the optimal number of hemming part and structure of bezel frame are very important process parameter to obtain the strength of that. The effect of process parameters on strength of bezel frame was investigated by FEA. Based on the result of FEA, the experiment was performed using manufactured hemming die, the result of the experiment was compared with FEA and verified. Also, three point bending tests were performed to check the strength of bezel frame.