The device that controls dynamic motions in a washing machine is called as MICOM. This device includes an IPM that controls the rotation of a tub. Also, the overheating of IPM gives cause for lowering the service life of an applied chip and is directly linked with its faults. A heat sink that is larger than the volume of the applied chip more than 50 times is installed to prevent such overheating. In the operation of the IPM, the temperature specification of the heat sink can be determined as $80^{circ}C$ under the air temperature of $25^{circ}C$. However, the heat sink used at the present time cannot satisfy this condition, so it is necessary to redesign such a heat sink to satisfy this condition. This study proposes an STM that is able to precisely calculate the temperature applied to IPM in a system level prior to redesigning the heat sink. The STM can be considered as a model that complements a JEDEC analysis model. This model implements a parameter analysis to perform the optimization of a heat sink and verifies the priority of parameters to reduce material costs. Furthermore, it investigates a counterproposal that replaces the conventional cooling methods in which it seeks a counterproposal that performs heat dissipation in a device according to the SoC of chips and is able to suppress EMI.