This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.