This study examined each handiwork method of 4 filigree artifacts from Neungsan-ri temple site in Buyeo, Korea through material characteristic and microstructure analysis. As a result, it was indicated that all of the artifacts have comparatively higher purity than 22.7K and some of filigree artifacts showed that gold is alloyed with silver at a certain ratio. Gold thread that decorates surface showed thickness of 0.2~0.8mm and displayed various forms of section. Gold granule indicated that 2 or 3 granules are adhered together and they are 0.3~0.8mm in diameter. Trace of soldering was observed from gold thread and gold granule joints on surface and it confirmed a possibility of being soldering using gold solder through componential analysis. Also, it reveals a surface decorated with pigments such as cinnabar(HgS) and black.