In this paper, we propose a new inspection method that applies fuzzy reasoning method considering the difference of brightness and intensity of illumination by bend together. In the preprocessing phase, we compensate the degree of semiconductor images with bilinear interpolation and moment-rotation. Then we use fuzzy reasoning method with the difference of brightness from error region by pattern matching and the difference of intensity of illumination from bends. Then the result is difuzzified and applied to the final inspection process. In experiment which uses 30 real world semiconductors with strait shots and side shots, the proposed method successfully discard the false positive identified by conventional brightness comparison only method without any loss of misidentification.