In this paper, we study the temperature change of a ${mu}$-bolometer focal plane array with a capacitive transimpedance amplifier bias cancellation circuit. Thermal analysis is essential to understand the performance of a ${mu}$-bolometer focal plane array, and to improve the temperature stability of a focal plane array characteristics. In this study, the thermal analyses of a ${mu}$-bolometer and its two reference detectors are carried out as a function of time. The analyses are done with the $30{mu}m$ pitch $320{ imes}240$ focal plane array operating of 60 Hz frame rate and having a columnwise readout. From the results, the temperature increase of a ${mu}$-bolometer in FPA by an incident IR is estimated as $0.689^{circ}C$, while the temperature increase by a pulsed bias as $7.1^{circ}C$, which is about 10 times larger than by IR. The temperature increase of a reference detector by a train of bias pulses may be increased much higher than that of an active ${mu}$-bolometer. The suppression of temperature increase in a reference bolometer can be done by increasing the thermal conductivity of the reference bolometer, in which the selection of thermal conductivity also determines the range of CTIA output voltage.