- 열접촉 저항을 고려한 사출금형의 온도분포특성 고찰
- ㆍ 저자명
- 김경민,이기연,손동휘,박근,Kim. Kyung-Min,Lee. Ki-Yeon,Sohn. Dong-Hwi,Park. Keun
- ㆍ 간행물명
- 소성가공
- ㆍ 권/호정보
- 2011년|20권 1호|pp.29-35 (7 pages)
- ㆍ 발행정보
- 한국소성가공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.