$217Plus^{TM}$, a newly developed as a surrogate of the MIL-HDBK-217, may be widely applied for reliability predictions of electronic systems. In this study, we performed sensitivity study of the $217Plus^{TM}$ system model to various parameters. Specific attention was put to logistics model and its behavior has been examined in terms of non-component failure causes. We first briefly explained the $217Plus^{TM}$ methodology with system level failure rate evaluation. We then applied experimental designs with several failure causes as factors. We used an orthogonal array with three levels of each parameter. Our results indicate that cannot duplicate, induced, and wear-out causes have dominant effects on the system failures and design, parts, and system management have much less but a little strong effects. The results in this study not only figure out the behavior of the predicted failure rate as functions of failure causes but provide meaningful guidelines for practical applications.