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Determination of Thermal Contact Conductance of an Injection Mold Assembly for the Prediction of Mold Surface Temperature
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  • Determination of Thermal Contact Conductance of an Injection Mold Assembly for the Prediction of Mold Surface Temperature
  • Determination of Thermal Contact Conductance of an Injection Mold Assembly for the Prediction of Mold Surface Temperature
저자명
Lee. Ki-Yeon,Kim. Kyeong-Min,Park. Keun
간행물명
한국생산제조시스템학회지
권/호정보
2012년|21권 6호|pp.1008-1012 (5 pages)
발행정보
한국생산제조시스템학회
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정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
서지반출

기타언어초록

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.